UniversityWafer, Inc. Oxide Strip

Processes, Applications, and Key Considerations

What is Oxide Strip?

Oxide strip refers to the process of removing silicon oxide (SiO₂) from the surface of a silicon wafer or other materials. This process is commonly used in semiconductor and microfabrication industries to prepare the surface for further processing or to remove unwanted oxide layers formed during previous steps.

Key Methods for Oxide Stripping

1. Wet Chemical Etching

2. Dry Etching (Plasma Etching)

Uses reactive ion etching (RIE) or other plasma-based techniques to remove oxide layers with high precision. This method is ideal for selective or patterned oxide removal.

3. Vapor-Phase Etching

Uses vaporized HF and sometimes water vapor to etch SiO₂. Preferred for delicate structures, as it avoids capillary forces seen in liquid-based etching.

oxide strip process in semiconductor fabrication

Applications of Oxide Stripping

Considerations in Oxide Strip Processes